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Yangyang Sun, ; Wong, C.P. . (2006). [IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Room Temperature Stable Underfill with Novel Latent Catalyst for Wafer Level Flip-Chip Packaging Applications. , (), 1905–1910. doi:10.1109/ectc.2006.1645921 
An interview with Sci-Hub Founder Alexandra Elbakyan,Who exactly should pay for academic research